KJ Ceramics 31

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Detailed Program

Paper Number : TF-P15

Time Frame : 12:00~13:30

Presentation Date : Friday, 28, November

Session Name : Thin Films & Layers

Session Chair 1# :

Session Chair 2# :

Study on surface analysis by solution agitation of the electroless copper plating for flexible devices

Seung-deok Baek

Hanbat National University

Because the present study, a flexible device recently appeared, thereby forming a Silver paste pattern using a screen printing method to the wiring selective on PET. The enhanced mechanical bonding force between Silver paste the PET by the atmospheric pressure plasma treatment on the PET substrate prior to screen printing. After producing a copper thin film using an electroless plating method and the next, and analyzed with respect to the surface of the copper thin film by changing the stirring speed.
The hydrogen ion concentration(pH) during the electroless copper plating was neutral condition is 7. When plating is performed to give a variation from 0rpm to 1000rpm and the stirring rate of the solution. PET is used as the substrate. Copper film grown by electroless plating, and analyzed the characteristics by using XRD(X-ray Diffraction), FE-SEM(Field Emission Scanning Electron Microscope), AFM(Atomic Force Microscope), and XPS(X-ray Photoelectron Spectroscopy).

References:

[1] Yang-Rae Cho, Youn-Seung Lee, Sa-Kyun Ra, Korean Journal of Materials Research, Vol.23, No.11, pp. 661-665, 2013
[2] Joo-Yul Lee, Man Kim, Deok-Jin Kim, J. Kor. Inst. Surf. Eng, Vol. 41, No. 1, 2008.

Acknowledgements :

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