| Home | Log-in | Admin | Sitemap |
Home | Program | Detailed Program
Detailed Program
Paper Number : TF-P16
Time Frame : 12:00~13:30
Presentation Date : Friday, 28, November
Session Name : Thin Films & Layers
Session Chair 1# :
Session Chair 2# :
Effects of DMAB in Electrolss Ni-B Plating for F-PCB
Hyung-Chul Kim
Hanbat National University
Keywords: DMAB, Amorphous, Electroless plating, Nickel-Boron

Flexible and portable electronic products are the most popular because of further miniaturization accompanying more functionality per device and low costs.[1] Flexible substrate such as Polyimide(PI) and Polyethylene terephthalate(PET) is used for Flexible Printed Circuit Board(F-PCB) because of lightness, thin thickness, and superior flexibility. So, F-PCB will become more important To metalize PET substrate.
In this study, we were plating the Nickel-Boron(Ni-B) film on printed Silver(Ag) on PET by electroless plaitng in neutral solution at low temperature for reducing the substrate damage. Ni–B alloy film is one of the functional coatings and is applied in aerospace, automotive, chemical and electrical industries due to their high hardness, high wear and corrosion resistances and good solderability.[2] We investigated the amount of Dimethylamine Borane(DMAB) effect as a reducing agent for electroless Ni-B.
X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM), X-ray Photoelectron Spectroscopy (XPS), Extended X-ray Absorption Fine Structure (EXAFS) were used for analysis of Ni-B films. As a result of XRD, increasing the amount of DMAB made a amorphization of Ni-B film and EXAFS data agree with the result of the XRD also. As a result of OM, the Ni-B film grew selectively on only patterned Ag paste surface.


References:

[1] S. H. Park and D. N. Lee, Journal of Materials Science, 23(5), 1643–1654 (1988)
[2] H, Ogihara, K. Udagawa and T. Saji, Surface & Coatings Technology, 206, 2933 (2012)
Acknowledgements :