| Session Code : TF-P |
Time Frame |
Paper No |
Title |
12:00~13:30 |
TF-P02 |
Effects of La Doping on the Structural and Electrical Properties of Bi7Fe3Ti3O21 Thin Film Dr.Chinnambedu Murugesan Raghavan |
12:00~13:30 |
TF-P01 |
Structural and Electrical Properties of Chemical Solution Deposited 0.7BiFeO3-0.3CaTiO3 Solid Solution Thin Film Dr. Jin Won Kim |
12:00~13:30 |
TF-P03 |
Effects of Seed Layer on the Structural Properties of R.F. Sputtering ZnO Thin Films Prof. Seunghwan Yi |
12:00~13:30 |
TF-P04 |
The influence of Ag interlayer on the electrical and optical properties of ZTO/Ag/ZTO multilayer films Mr. Taekyung Gong |
12:00~13:30 |
TF-P05 |
Effect of Ti buffer layer on the optical and electrical property of In2O3 thin films Mr. Jaehyun Jeon |
12:00~13:30 |
TF-P06 |
Composition-dependent Functional Properties of High Quality PZT Films for Micro-scale Electronic Device Applications Mr. Jusung Kim |
12:00~13:30 |
TF-P07 |
Effect of annealing condition on properties of SnO2/Zn/SnO2 multilayer thin films deposited by RF sputtering Mr. Sungjae Kim |
12:00~13:30 |
TF-P08 |
Optimized Process Conditions of Pt Bottom Electrode for High Quality Piezoelectric Films and Multi-functional MEMS Devices Ms. Sunyoung Lee |
12:00~13:30 |
TF-P09 |
Electronic structure and magnetic properties of Mn doped TiO2 thin films using X-ray absorption spectroscopy Dr. Kumar Shalendra |
12:00~13:30 |
TF-P10 |
Development of High Energy Density Capacitors Development of High Energy Density Capacitors Using Anti-ferroelectric PLZT Thin Films Dr. Dong chan Woo |
12:00~13:30 |
TF-P11 |
Multilayer Coatings for Protecting Carbon Materials at temperatures at 1700 C or higher Changhun Hwang |
12:00~13"30 |
TF-P12 |
Thin film multi layer ceramic capacitors (MLCC) using high-dielectric Bi2Mg2/3Nb4/3O7 (BMNO) Ji-hyun Park |
12:00~13:30 |
TF-P13 |
Simultaneous realization of electromagnetic shielding and antibacterial effect of Al doped ZnO multi-layer thin films Hyung-Jin Choi |
12:00~13:30 |
TF-P15 |
Study on surface analysis by solution agitation of the electroless copper plating for flexible devices Seung-deok Baek |
12:00~13:30 |
TF-P16 |
Effects of DMAB in Electrolss Ni-B Plating for F-PCB Hyung-Chul Kim |
12:00~13:30 |
TF-P14 |
Sol-Gel Preparation of M+-Doped CuO (M+ = Li+, Na+, K+) Thin Films and Their Photocathodic Properties Kota ISOBE |
